Special measuring methods for high-performance electronics

Topic

From nΩ to GΩ at temperatures from -40 up to 1000 °C and the most diverse test geometries: With the special measurement methods for high-performance electronics of Fraunhofer IKTS, your products can be measured along the entire resistance and temperature scale.

For this purpose, the "Hybrid Microsystems" department develops functional ceramic materials for use in harsh environments. These materials can be processed and applied in complex microsystems using a wide variety of synthesis, build-up, joining, layer deposition and structuring methods, depending on requirements and customer needs.

To determine the performance, quality and safety of the materials and components, the IKTS group "System Integration and AVT" offers special measurement methods that can be used to characterize the reliability of the materials and products. For example, electrical and mechanical properties can be analyzed in long-term behavior, and the reliability of assembly and contact points or layer properties can be characterized.

Overview of methods for measuring electrical properties

Method

Voltage range

Current range

Pulse duration/ measuring time

Thick-film resistance relevant

Certification

Application

Electrostatic discharge (ESD)

10–30 kV

1 -10 A
(short time)

ns

Yes

DIN EN 61000-

4-2

Device safety, thick-film resistors

Partial discharge behavior

15k V AC (10 kV DC)

s, min, h

 

No

DIN EN 60270

Insulators

Breakdown voltage

500–2000 V

10 mA

min

No

DIN 41850

Isolation paste

Insulation resistance

10–1000 V

 

min

No

DIN 41850

Isolation paste

Short term overload (STOL)

100 V

1 – 10 A

5 s

Yes

MIL STD 883

Max. loss density of thick-film resistors

Current carrying capacity

10 V

1 – 100 A

ms–s

Yes

Customized

Max. current carrying capacity combined with heating, power cycling, aging

Read more about the advantages of the individual electrical special measurement methods for high-performance electronics at Fraunhofer IKTS here.

Overview of methods for measuring mechanical properties

Method

Min. test force

Max. test force

Possible temperature range

Example standard

Application

Tensile test

10 mN

10 kN

RT

 

Peel strengths of soldered, bonded or sintered joints

 

Pull test

10 mN

1 kN

RT … 600 °C

DVS fact sheet 2810/2811

E.g., wire bond connections

 

Shear test

10 mN

1 kN

RT … 600 °C

DVS fact sheet 2810/2811

E.g., assembled components

Read more about the advantages of the individual mechanical special measurement methods for high-performance electronics at Fraunhofer IKTS here.

 

Services offered

 

  • Electrical measurement methods for high power electronics: Electrostatic discharge (ESD), partial discharge, breakdown voltage, insulation resistance, short term overload (STOL), current carrying capacity
  • Mechanical measurement techniques for high power electronics: tensile and peel tests, pull and shear tests
  • Power cycling
  • Lifetime analysis methods
  • Infrared characterization
  • Methods for series and inline testing
  • Customized method for testing thermal, electrical and mechanical safety and reliability of components

Topic

Electrical Special Measurement Methods for High-Performance Electronics

Topic

Mechanical Special Measurement Methods for High-Performance Electronics