The strength of bonded, sintered, or soldered interconnects is investigated at Fraunhofer IKTS using shear tests. The assembled component is located on a substrate. During the test, a geometrically adapted shear bit is moved against the sample to be tested. After a touch-down, the sample is sheared with a specified shear height, force, and speed. The force-displacement curves are recorded and evaluated.
The quality of the mechanical interconnects is measured on the one hand by the force applied to destroy the joint and on the other hand by the resulting fracture pattern. A special feature at the IKTS is that the staff can test the shear strength for restricted specimen geometries up to a temperature of 600 °C.
This allows the test to be carried out at a very high temperature. Furthermore, investigations in a wide range of applications are possible due to different shear bit geometries and force ranges.