Since 1992, the Thick-Film Technology workgroup’s core competency has been the development and characterization of functional special pastes and inks (conductor, resistor and covering pastes, pastes for heater and sensor applications). In addition to the development of materials for classic screen- or stencil-printing technology, the group’s attention is also increasingly focused on functional printing applications, i.e. the intelligent functionalization of 3D components made with additive manufacturing techniques. Digital printing technologies, such as dispensing, dispense-jet as well as ink-jet and aerosol-jet® printing are used for this purpose; these technologies are well established within the institute.
The development team, which comprises chemists and materials scientists, works closely with the neighboring groups of the Hybrid Microsystems department in order to be able to solve all tasks for our clients throughout the value chain, from the material to the component.