The processing of glass-bonded thick-film pastes is carried out in a temperature range of 600-100 °C on ceramic substrates. The advantage of this processing technology: the components can be used in a higher temperature range. In addition, very simple components can be produced by this technology. Examples are both ceramic electronic substrates and ceramic sensors or heaters. The group has extensive expertise in creating user-specific layouts for such components. The lateral geometry of the modules can be freely configured. The adaptation to given boundary conditions is possible.
- Creating custom layouts and design documentation
- Realization of prototypes
- Thermal dimensioning
- Design, fabrication and characterization of heating elements