Fraunhofer Institute for Ceramic Technologies and Systems IKTS
When ceramics with different thermal expansion coefficient have to be joined by solder glasses it becomes necessary to overcome this mismatch multiple graded films of glass solders must be layered. For this application pure glass pastes and glass-ceramic-composite pastes are used. The different pastes can be fired under typical thickfilm conditions and adjusted in their thermal expansion behavior for use in combination with different ceramics.