The manufacturing of ceramic multilayers, especially LTCC and HTCC, is based on a typical technological process. At first tapes get casted in the Doctor-Blade-Process. These so called green sheets are then structured using micromachining tools like punching, laser and embossing technologies. After punching and via filling by mask-printing conductors are screen-printed. Afterwards the single layers are aligned, stacked and at last laminated under high temperature and pressure. During the sintering process all organics burn out and the ceramic multilayer is compacted to a monolithic ceramic body. Sintering temperatures are above or below 1000 °C, depending on whether the used substrate material is LTCC or HTCC. At last functional elements in thick film technology or SMT are applied in a post process. Because of the production in multiple panels (wafer technology) the substrates have to be finally separated by lasering or dicing.