LOPEC 2026 - Fraunhofer IKTS

Trade fair / February 24, 2026 - February 26, 2026

LOPEC

LOPEC (Large-area, Organic & Printed Electronics Convention) is the world's leading trade fair and congress for flexible, organic and printed electronics. Printed electronics is one of the key technologies of the 21st century and is used in areas such as automotive engineering, power generation, medical technology and everyday appliances.

Fraunhofer IKTS will be presenting novel materials for printed and flexible sensors as well as material and process development for battery storage and multilayer ceramic high-frequency components.

Booth 501, Hall B0

Event details

Program

Poster presentations

Fabrication of Multilayer Ceramic Electronics by Multi-Material Printing and Cofiring, Prashantkumar Pandey, February 26, 2:40 p.m., Room 2
Manufacturing and application scenarios of printed magnetic field sensors, Clemens Voigt, February 26, 3:40 p.m., Room 4

Location

Munich, Germany

Date

February 24, 2026 - February 26, 2026

Development of inks for digital printing

Fraunhofer IKTS develops customized nano-inks for microprinting processes such as inkjet, aerosol printing, fine-line screen printing and microdispensing. The range of materials includes precious metals (e.g. Au, Pt, Ag), silicon, carbon, magnetic inks and ceramic oxide inks or composite inks with glass additives.

Temperature-resistant marking inks for the permanent labeling of metal and ceramics

In metal processing, including forging, hot forming and hardening, the marking of semi-finished products using "direct part marking" plays a central role in the optimization of production processes and quality assurance. The biggest problem with the labeling of components is the sometimes very high processing temperatures (500 to 1300 °C) and demanding processing conditions. With a marking process developed at Fraunhofer IKTS, high-temperature-resistant markings can be realized with industrial inkjet printers. Customized high-temperature resistant inks based on ceramic molded bodies and glass are available for this purpose.

Product sheet: Temperature-resistant marking inks for permanent labelling with inkjet [ PDF 0.64 MB ]

Biocompatible gold and platinum inks for printed electrodes in biomedical sensor technology

Fraunhofer IKTS has developed special inks and pastes that can also be printed on flexible substrates such as plastic or paper, enabling integration into wearable or flexible biosensor systems. The gold and platinum inks in the form of printed electrodes have been successfully tested several times for biocompatibility according to DIN EN ISO 10993-5 / -12.

Product sheet: Printed electronics and biocompatible electrodes for biomedical sensors [ PDF 0.42 MB ]

Material developments for energy storage systems

Fraunhofer IKTS is developing materials and processes for new battery concepts, such as the ceramic solid-state battery (Li and Na-based). Work is also being carried out on innovative 3D metal foam electrodes with a very high surface capacity and on bipolar electrodes based on polymer collector foils. Using various coating technologies, the active materials are processed as slurries, printed as pastes or infiltrated as inks.

Product sheet: Material and process development for battery storage systems [ PDF 0.41 MB ]

Printed flexible magnetic field sensors using cost-efficient materials

The novel printed magnetoresistive (MR) sensors developed in collaboration between Fraunhofer IKTS and HZDR are based on cost-efficient materials in powder form, rely on scalable manufacturing process and show high performance. Bismuth is used as a sensor material due to its known high, non-saturating MR effect. In contrast to rigid SMD sensors available as surface mount devices, our sensors are mechanically flexible. Moreover, their manufacturing does not require vacuum or special gas equipment contrary to thin-film MR sensors.

Product sheet: Printed flexible magnetoresistive sensor [ PDF 0.27 MB ]

Multi-layer ceramic high-frequency components with PI pastes

Fraunhofer IKTS combines multilayer ceramics, ultrafine conductor structures, and integrated passive components in a robust substrate using LTCC (low-temperature co-fired ceramics). The result is compact assemblies with excellent high-frequency performance up to the millimeter wave range (mmW), low power dissipation, high thermal stability, and maximum reliability under harsh environmental conditions. PI paste technology (Photoimageable Paste Systems) makes LTCC mmW components smaller, faster, and more reliable.

Trade fairs

Trade fair / February 24, 2026 - February 26, 2026

LOPEC

Event details

Program

Location

Development of inks for digital printing

Temperature-resistant marking inks for the permanent labeling of metal and ceramics

Biocompatible gold and platinum inks for printed electrodes in biomedical sensor technology

Material developments for energy storage systems

Printed flexible magnetic field sensors using cost-efficient materials

Multi-layer ceramic high-frequency components with PI pastes

Contact Press / Media

Dr.-Ing. Paul Gierth

Contact Press / Media

Dr. Marco Fritsch

Contact Press / Media

Patrick Menke