Trade fair / March 10, 2026 - March 12, 2026
CIPS
CIPS (International Conference on Integrated Power Electronics Systems) focuses on the assembly and connection technology of power electronic components as well as the integration of hybrid and mechatronic systems with high power density.
Fraunhofer IKTS will be presenting technologies for customized ceramic substrates and degradation analyses.
Foyer, Booth 4