Printing

Screen-printing:

• Conductors, resistors, isolators and sensory elements
• Minimal Line/Space: 50 µm/50 µm
• Minimal layer thickness: <1 µm
• Maximal layer thickness: 50 µm

 

Mask-printing:

• Filling of channels, deep structures and vias with metallization, insulation or sacrificial pastes
• Printing in cavities
• Minimal fillable structures (vias) 50 µm diameter

Direct writing systems:

• Aerosol Jet printing
• Direct coating without masks
• Aerosol generated with pneumatic or ultrasonic vaporizer
• Minimal Line/Space: 10 µm/10µm
• Minimal layer thickness: 0,1 - 10 µm

Inkjet-Printing

Dispensing

• Layer thickness: (0,1 - 1,5) mm