Electronics and Microsystems

Materials

• Single- and multilayered substrates made from oxide and non-oxide ceramics (Al₂O₃, SiN, AlN)
• Functional and electroceramics (dielectrics, piezoelectrics, resistors, magnetic materials, among others)
• Polymer ceramics

Technologies

• Thick-film and multilayer technology (complete line for HTCC, LTCC)
• Pastes, inks, ceramic green tapes
• Feedstocks for polymer ceramics
• Thin-film technology (thermal CVD, PECVD, thermal ALD, PVD, LPD)
• Injection molding and casting technology
• Microsurface and surface processing (laser embossing, microstamping)
• Technology development and optimization, techniques for scaling to the pilot-plant scale

Systems integration, packaging technology

• Packaging technology (bonding, soldering, joining, encapsulation)
• Advanced packaging (3D integration, embedding)
• Design and production of components and modules
• Design and integration of sensor systems (eddy current, ultrasound, X-ray, and chemical and physical sensor technologies)
• Structural integration of electronic components

Reliability of electronics

• Compilation of materials data at various size scales
• Material characterization and nanoanalytics (www.nanoanalytik.fraunhofer.de)
• Clarification of degradation and failure mechanisms
• Customer-specific test routines and micromechanical test engineering
• Modeling and simulation at the material, component, and systems level
• Design rules for reliable and robust components