Characterization of microsystem components using high-resolution X-ray microscopy

Service

With the help of the Cheetah EVOplus X-ray system (YXLON International GmbH), Fraunhofer IKTS can inspect components non-destructively for defects or damage and thus carry out well-founded defect analyses. Thanks to the large inspection area of 460 x 410 mm, the high resolution of 300 nm and the flexible software, both large components and a large number of smaller components can be analyzed and evaluated simultaneously. The integrated calibration routines ensure that the measured values are automatically transferred to protocols. 

 

Technical characteristics
 

  • Inspection area: 460 mm x 410 mm
  • Maximum component size: 800 mm x 500 mm
  • Tube type (open): up to 160 kV at 1 mA
  • Tube power: 64 W with a target power of 15 W
  • Detail detectability: < 300 nm
  • Maximum geometric magnification: 3000x
  • Oblique view of samples: ±  70°

 

X-ray system for characterization in the field of materials technology and microelectronics.
X-ray system for characterization in the field of materials technology and microelectronics.
µ-CT analysis using the example of a multilayer ceramic circuit carrier.
µ-CT analysis using the example of a multilayer ceramic circuit carrier.

 

Examples of examined components

Object: Printed circuit board (PCB)
Object: Printed circuit board (PCB) Objective: Empty spaces in the die-attach area and in the bond-pad area
Object: Multilayer ceramic rewiring carrier made of LTCC
Object: Multilayer ceramic rewiring carrier made of LTCC | Objective: Defect inspection of via stacks and buried conductor path structures (oblique transmission)
Object: Ceramic substrate (nonoxide ceramics)
Object: Ceramic substrate (nonoxide ceramics) Objective: Visualization of defects (substrate-internal pores and pore distributions)
Object: Ceramic substrate (oxide ceramics)
Object: Ceramic substrate (oxide ceramics) | Objective: Visualization of defects (substrate-internal cracks and structural inhomogeneities)

 

Range of services

 

  • Creation of X-ray microscopy images in perpendicular and oblique radiation and CT
  • Analysis and measurement of buried structures
  • Defect analysis
  • Creation of automated measuring routines for higher quantities
  • Creation of measurement and test protocols
  • Development of further characterization methods and transfer to the client