The substantial progress recently made in semiconductor technology (SiGe, CMOS, GaAs, etc.) allow a high integration for millimeter waves (mmW) circuits. This enables a multitude of applications in automotive technology (for example vehicle interval radar sensors), industry 4.0. (e.g. fluid level radar) or communication technology (5G-Network or satellite communication). In contrast the development of cost-efficient, reliable and miniaturized packages for mmW circuits makes a moderate progress.
For frequencies up to 100 GHz circuits based on special polymer substrates become established as cost-efficient and mass production-suitable packaging solution. However these materials show up with a lack of reliability in a harsh environments and a limited performance due to higher losses compared to high-quality materials as LTCC (Low Temperature Cofired Ceramics).
The basic approach of our group LTCC, HTCC and microsystems is to establish LTCC materials as a basic packaging solution for millimeter wave applications and antennas in order to develop reliable and miniaturized microelectronic RF-components. LTCC offers a high reliability, an ideal thermo-mechanical fit to semiconductors and the possibility of a hermetic seal. LTCC in combination with a new, high resolution structuring technology allow unique low loss characteristics above 100 GHz.