Flat assemblies, such as electronic circuit boards, can only be examined with insufficiently good resolution due to their usually large-area sample geometry. The distance between the X-ray source and the sample is usually too large to examine small sub-areas more precisely and to detect the smallest defects, such as cracks or pores, in solder joints (BGA, QFN, QFP).
Fraunhofer IKTS offers a special X-ray tomography method for this task, which can analyze partial areas of large-area circuit carriers, such as printed circuit boards, in a high-resolution and non-destructive manner. With the so-called high-resolution computed laminography (HRCL), Fraunhofer IKTS in Dresden has a unique method for PCB examination at its disposal, in which the specimen can be examined with high resolution (up to 1.5 µm³) and with only one rotation. Extensive sample preparation for PCB inspection is no longer necessary. The HRCL can also be used for automatic X-ray inspection (AXI).