Cold sintering processing (CSP) is an emerging method of ceramic material densification under applied pressure and using reactive additives. It offers substantially reduced sintering temperatures (<400°C) and shorter processing time as compared to conventional furnace-based methods. Fraunhofer IKTS investigates influence of sintering additives and processing parameters on the resulting material properties and microstructure to realize novel material combinations with improved performance.
Key features of the technology
- Sintering of a broad range of materials under high pressure at temperatures below 400°C
- Co-sintering of ceramics and other materials with very different conventional sintering temperatures
- Avoiding undesired thermal decomposition reactions during sintering
- Sintering of material composites with different thermal stability ranges (e.g. ceramic/polymer)
Demonstrated materials and components
Electrolyte tapes for Na solid-state batteries
- Production of thin (thickness <260 µm), translucent NaSICON tapes
- Ionic conductivity of 0.27 mS/cm after CSP at 375°C