Fraunhofer Institute for Ceramic Technologies and Systems IKTSDue to their electrical properties, high mechanical strength and good thermal conductivity, HTCC housings can be used as hermetic packages in the aerospace industry, in medical devices or for high-temperature applications. HTCC technology with aluminum oxide ceramics as the base material in combination with tungsten for cost-effective electrical rewiring within the ceramic is an attractive technology for this purpose.
In recent years, Fraunhofer IKTS has developed a tailor-made system of co-sinterable tungsten pastes for inner and outer layers as well as for via metallization, which have been optimally adapted to the shrinkage behavior of the aluminium oxide. The tungsten layers show homogeneous surfaces whose suitability for electroless plating (e.g. deposition of Ni and Au layers (ENIG)) and subsequent established electronic packaging technologies such as soldering and bonding could be demonstrated.
To illustrate this, a demonstrator was built using ceramic multilayer technology based on these tungsten pastes.
Technical parameters
- Size 4.75 mm x 4.75 mm x 1 mm
- Cavitiy 3.5 mm x 3.5 mm x 0.35 mm
Services offered
- Development of customized tungsten HTCC housings::
- Customer advice on manufacturing options
- Housing design according to customer requirements
- Development and qualification of manufacturing processes
- Sample production, technology transfer
- Requirement-specific development of co-sinterable tungsten pastes
