Fraunhofer Institute for Ceramic Technologies and Systems IKTSThe research conducted by Fraunhofer IKTS and its partners focuses on integrating additional sensor technology into existing power electronics modules. Using thin-film technologies, for example, ceramic DCB substrates can be functionalized prior to component mounting. To achieve this, additional insulation and functional layers for a wide variety of sensors are deposited using printing techniques. By utilizing these sensors, additional status information about the modules can be collected during operation, and important state-of-health parameters can also be derived using appropriate testing strategies. The manufacturing technologies under consideration and the state-of-health analysis of such system assemblies are intended, in particular, to enable SMEs to identify and establish business models with economic potential in this field.
Rethink
Schematic diagram of a power substrate in a protective housing with polymer encapsulation and integration of a thin-film layer and sensor electrode for state-of-health analysis.
The “GANZ Rethink” subproject, part of the “GANZ Power Electronics” flagship project funded by the BMWK, is being carried out by the project partners Fraunhofer IKTS Dresden and TU Dresden.