Particle-free metallization ink
Particle-free inks are suitable for metallization processes in photovoltaics, microelectronics and sensor technology. In contrast to particle-containing pastes applied in industry, there is the possibility to deposit particle-free inks without contact by inkjet or aerosol printing. Those deposition techniques allow solving different adhesion and contact formation problems and prevent wafer breakage.
The precursor inks (particle-free) developed by our working group have a low viscosity and their metal content is completely dissolved. Due to this, these inks are true solutions. Particularly, coinage metals are beneficial for conductive materials, but also nickel, palladium and platinum were used. According to the fact that those inks do not contain particles, there is no sedimentation, agglomeration and therefore less nozzle clogging. It is possible to use a variety of metals and to print in multiple layers. The inks are also suited for seed layer printing which have a low thickness and a small line width. Depending on the deposition method, the ink has to be adjusted in its viscosity, surface tension, density and its wetting behavior.
- Synthesis of metal precursors for particle-free metallization inks
- Contact angle measurement of inks or suspensions on different substrates
- Printing tests
- Schlenk apparatus for synthesis of metal precursors
- Drop-shape analyzer
- Inkjet lab tool
- Pull and shear test system to measure adhesion
- Ultrasonic bath for ink treatment
- Front-side metallization of solar cells (photovoltaics)
- Conductive paths for microelectronics
- Conductive paths on flexible substrates