Joining Technology

Group

Active filler brazes for joints of nitride ceramics and metal foils

Topic

SEM image of the interfacial

SEM image of the interfacial region of an active brazed Copper-Si3N4-joint

Joints of metal foils (Cu, Ni, Mo, Ag) with high strength and thermal conducting ceramics such as AlN and Si3N4 can be realized by optimized active filler brazes. This offers very good electrical conducting and structured metallic layers on nitride ceramics for converters or passive components for thermoelectric converters.