Fraunhofer Institute for Ceramic Technologies and Systems IKTSInnovative methods of packaging and joining technology are elementary for tape casting technology. In the end, they significantly determine the performance and load capacity of a component. The research group “Ceramic tapes” uses various printing and coating techniques to functionalize ceramic tapes as well as innovative joining technologies to assembly complete systems.
Services offered
- Printing and coating techniques (e.g. screen printing, pad printing, 3D electrode internal coating) for the functionalization of ceramic green tapes
- Development of adapted special pastes (conductive, insulating and resistive pastes) for microsystems technology
- Development and production of electrical and electronic components and parts
- Joining of different ceramic components or metals
- Production of customer samples from laboratory to pilot plant scale
References
- Housings for sensors and reference electrodes with corresponding diaphragm
- Ceramic hollow fiber modules
- Internal metallization of electroceramic honeycomb bodies for self-regulating heaters
- Ceramic components for ozonizers, sensors for determining chemical and physical parameters such as pressure, displacement or angular position, temperature-stable pressure sensors for high and low voltage applications
