Functionalization of tapes and substrates


Innovative methods of packaging and joining technology are elementary for tape casting technology. In the end, they significantly determine the performance and load capacity of a component. The research group “Ceramic tapes” uses various printing and coating techniques to functionalize ceramic tapes as well as innovative joining technologies to assembly complete systems.


Services offered


  • Printing and coating techniques (e.g. screen printing, pad printing, 3D electrode internal coating) for the functionalization of ceramic green tapes
  • Development of adapted special pastes (conductive, insulating and resistive pastes) for microsystems technology
  • Development and production of electrical and electronic components and parts
  • Joining of different ceramic components or metals
  • Production of customer samples from laboratory to pilot plant scale




  • Housings for sensors and reference electrodes with corresponding diaphragm
  • Ceramic hollow fiber modules
  • Internal metallization of electroceramic honeycomb bodies for self-regulating heaters
  • Ceramic components for ozonizers, sensors for determining chemical and physical parameters such as pressure, displacement or angular position, temperature-stable pressure sensors for high and low voltage applications


Technical equipment

© Fraunhofer IKTS
EKRA-M2 (I) screen printing machine.
© Fraunhofer IKTS
EKRA-M2 (II) screen printing machine.
© Fraunhofer IKTS
DEK Type 03iX screen printing machine.
© Fraunhofer IKTS
Teca-Print 70 pad printing machine.
© Fraunhofer IKTS
EKRA-Microelectronic 2H screen printing machine.