Characterization of microsystem components using high-resolution X-ray microscopy


© Fraunhofer IKTS
X-ray system for characterization of microsystem components.
© Fraunhofer IKTS
X-ray image of a ceramic differential pressure measurement system with electronics (detail detectability < 300 nm).

With the help of the Cheetah EVOplus X-ray system (YXLON International GmbH), we can non-destructively inspect manufactured microsystem components for defects or damage and thus perform well-founded defect analyses. Due to the flexible software and the large inspection area of 460 x 410 mm, both large components and many smaller components can be analyzed and evaluated simultaneously. The integrated calibration routines ensure automated transfer of the measured values to protocols.


Technical data


  • Inspection area: 460 mm x 410 mm
  • Maximum component size: 800 mm x 500 mm
  • Tube type (open) up to 160 kV at 1 mA
  • Tube power 64 W with a target power of 15 W
  • Detail detectability: < 300 nm
  • Maximum geometric magnification: 3000x
  • Oblique view of samples: ± 70°


Services offered


  • Creation of X-ray microscopy images in perpendicular and oblique transmission
  • Analysis and measurement of buried structures
  • Defect analysis
  • Creation of automated measurement routines for higher quantities
  • Creation of measurement and test protocols
  • Development of further characterization methods and transfer to the customer