High-resolution computed laminography (HRCL) is an optimized version of cone-beam tomography. With its modified orientation of X-ray tube and X-ray detector, HRCL enables bringing the planar specimen very close to the X-ray source while retaining the full rotational freedom. The modified measurement setup and an optimized reconstruction algorithm mean that high-resolution analyses of printed circuit boards are no longer a problem.
For instance, it is possible to analyze control boards for automotive and power electronics, as well as embedded systems, in a non-destructive way, even though a very high local resolution is required in order to represent small areas of large-area specimens. HRCL is an adequate replacement for characterizing specimens through metallurgical grinding. Following the measurement, the specimens can be used for further characterization or reinstalled in their original location.
Another strength of high-resolution computed laminography (HRCL) is the extraction of surface data which can be processed further using 3D CAD software. As in µCT, the 3D data thus gained can be used for rapid prototyping applications.