Department
High-temperature component labeling under UV light.
Change in speckle pattern with time for condition monitoring of processes and components.
Simulation-assisted determination of failure behavior of electronic assemblies.
Components, structural assemblies, electronics, and microsystems as well as technical installations should function reliably at all times. The "Testing of Electronics and Optical Methods" department has the materials characterization methods and process knowledge needed to meet a multitude of testing demands. Non-destructive optical methods, structural mechanics simulations, and destructive test methods are used in component design, quality testing, and reliability evaluation.