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Development of functional ceramics and of miniaturized components and systems is the focus of the “Hybrid Microsystems” department. Applications lie in the areas of packaging for electronics and high-power electronics, sensors, and energy technology (micro-fuel cells and photovoltaics).
For the deposition of functional layers, both classic screen printing technology and additional mask-based (stencil and gravure printing) and digital printing processes (aerosol and inkjet printing) can be used, depending on the application requirements. In addition, a complete ceramic multilayer technology line (LTCCs, HTCCs) is available at Fraunhofer IKTS to produce 3D-structured components.
We also offer our customers a wide range of technologies for electrical contacting (soldering, gluing, bonding) and for mechanical and microstructural characterization of electrical connections.
Development, Preparation, and Characterization of Pastes and Inks
All equipment required for preparation and characterization of thick film pastes and inks (e.g., rheometry)
Development and Preparation of Ceramic Films
Continuous tape casting machines
Component Layout, Circuit Design
Simulation: FlexPDE, Comsol
CAD: SolidWorks, AutoCAD
Circuit design: Altium Designer, Durst Hyde
Deposition Technologies for Functional Coatings
Screen printing (planar and tubular)
Stencil and gravure printing
Inkjet and aerosol printing
Ceramic Multilayer Technology
Complete 8” x 8” multilayer line: stamping and lasering, screen printing, isostatic and uniaxial lamination, LTCC firing: in air, N2, and vacuum, free-sintered and zero-shrinkage; HTCC: in air atmosphere
Ceramic Systems Integration
Wire bonding (ultrasonic and thermosonic)
Soldering (dip and reflow)
Pull and shear test